Multilayer Eco-Friendly Compounds For Complex Environmentally Safe Structures
Abstract
The formation of highly reliable multilayer metallization systems is one of the priority tasks of modern microelectronics. In this work, thin-film layers of interconnects separated by polyimide layers are studied. A multilayer ceramic or silicon substrate was used as the upper layer of the interconnects. The resulting structure, interconnecting a large number of VLSI chips, makes it possible to reduce delays, power consumption and noise levels. Multilayer thin-film structures were formed by irradiating the photoresist, followed by reactive ion etching, then pattern formation, and electron-beam evaporation. Three-layer films of chromium-copper-chromium are used as conductors, copper is chosen as a good electrical conductor, its conductivity is much higher than that of aluminum or aluminum-copper alloys. In order to avoid interaction of copper with polyimide and acids during the manufacturing process, chromium was chosen as a passivating metal. Crystals with rows of conductor lines were fabricated, on which the resistance of the Cr-Cu-Cr metallization system was measured using the four-probe method. The technology for manufacturing holes in multilayer interconnects of multichip integrated circuits and metallization parameters that give the best results are experimentally determined.
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About this article
Publication Date
31 October 2024
Article Doi
eBook ISBN
978-1-80296-133-1
Publisher
European Publisher
Volume
134
Print ISBN (optional)
-
Edition Number
1st Edition
Pages
1-658
Subjects
Sociolinguistics, linguistics, semantics, discourse analysis, translation, interpretation
Cite this article as:
Mustafaev, G. A., Mustafaev, A. G., & Khasanov, A. I. (2024). Multilayer Eco-Friendly Compounds For Complex Environmentally Safe Structures. In D. K. Bataev, S. A. Gapurov, A. D. Osmaev, V. K. Akaev, L. M. Idigova, M. R. Ovhadov, A. R. Salgiriev, & M. M. Betilmerzaeva (Eds.), Social and Cultural Transformations in the Context of Modern Globalism (SCTCMG 2023), vol 134. European Proceedings of Social and Behavioural Sciences (pp. 315-321). European Publisher. https://doi.org/10.15405/epsbs.2024.10.40